Encapsulation

High voltage and harsh environmental requirements have led to Coiltron’s development of a detailed molding process using the best materials in the industry.

We are continually improving our manufacturing techniques to better suit our customer’s needs.

Coiltron uses specially designed vacuum tanks, ovens, and UV lighting to impregnate, encapsulate, and cure the epoxy resins and glues.

Coiltron designs the masters, builds the molds, and selects the best material to meet your specific requirements. Our innovative processes can eliminate costly tooling that other manufactures require.

Coiltron’s unique encapsulation process is engineered into the design on many of our coils and transformers. We have a rich history in encapsulation processes, and technology, which makes us an industry leader.

Encapsulation can be done on the following and more.

• High Voltage
• Environmental
• Concealment
• Circuit Board
• Conformal Coatings
• Resins

A trio of Coiltron custom electronics: two SPAN LITE Rev A PCBs with large capacitors and heat sinks, and one fully encapsulated black power module with multiple red quick-disconnect terminals, featuring golf balls for scale.
Coiltron custom PCB assemblies with electrolytic capacitors shown next to a separate metal heat sink, an empty black housing, and a final potted power module with red wire terminals.